Reactive diffusion under Laplace tension

Ene C, Nowak C, Oberdorfer C, Schmitz G

Forschungsartikel (Zeitschrift) | Peer reviewed

Zusammenfassung

Nanostructures such as nanospheres or nanowires may contain surfaces and interfaces of pronounced curvature. To investigate the impact of severe curvature on the kinetic of reactions, thin-film Al/Cu/Al and Cu/Al/Cu triple layers are deposited on tungsten tips of 25 nm curvature radius. The thermal reaction of the layer structure is studied by atom probe tomography. Experiments demonstrate that the reaction rate depends significantly on the deposition sequence of metals. Interpretation of the observed reaction kinetics leads to the conclusion that under the influence of interfacial tension probably the two limiting cases of atomic transport, Darken and Nernst-Planck kinetics, are realized in dependence on the stacking sequence. (C) 2009 Elsevier B.V. All rights reserved.

Details zur Publikation

FachzeitschriftUltramicroscopy
Jahrgang / Bandnr. / Volume109
Ausgabe / Heftnr. / Issue5
Seitenbereich660-666
StatusVeröffentlicht
Veröffentlichungsjahr2009 (30.04.2009)
Sprache, in der die Publikation verfasst istEnglisch
DOI10.1016/j.ultramic.2008.12.001
StichwörterReactive interdiffusion Nanospheres Nernst-Planck coefficient Atom probe tomography Al/Cu thin-films alloys

Autor*innen der Universität Münster

Oberdorfer, Christian
Institut für Materialphysik
Schmitz, Guido
Institut für Materialphysik